Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6465337 | Methods of fabricating integrated circuit bonding pads including intermediate closed conductive layers having spaced apart insulating islands therein | Soo-Cheol Lee, Jong-Hyon Ahn | 2002-10-15 |