CL

Chun-Ho Lee

VT Via Technologies: 2 patents #7 of 47Top 15%
📍 Seoul, KR: #137 of 1,284 inventorsTop 15%
Overall (2002): #70,738 of 266,432Top 30%
2
Patents 2002

Issued Patents 2002

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6433648 Method and structure for reducing the mutual inductance between two adjacent transmission lines on a substrate — 2002-08-13
6380818 Structure for reducing the mutual inductance between two adjacent transmission lines on a substrate — 2002-04-30