Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6365260 | Arrangement for heat dissipation in chip modules on multilayered ceramic carriers, in particular multichip modules | Annette Seibold | 2002-04-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6365260 | Arrangement for heat dissipation in chip modules on multilayered ceramic carriers, in particular multichip modules | Annette Seibold | 2002-04-02 |