Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6349033 | Method and apparatus for heat dispersion from the bottom side of integrated circuit packages on printed circuit boards | Charles Matthew Erwin | 2002-02-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6349033 | Method and apparatus for heat dispersion from the bottom side of integrated circuit packages on printed circuit boards | Charles Matthew Erwin | 2002-02-19 |