Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6475327 | Attachment of a stiff heat spreader for fabricating a cavity down plastic chip carrier | I-Chung Tung, Jiun-Shian Yu, Kuo-Bin Chen | 2002-11-05 |
| 6432748 | Substrate structure for semiconductor package and manufacturing method thereof | — | 2002-08-13 |