EZ

Elke Zakel

SS Smart Pac Gmbh Technology Services: 1 patents #1 of 4Top 25%
📍 Falkensee, DE: #1 of 8 inventorsTop 15%
Overall (2002): #66,716 of 266,432Top 30%
2
Patents 2002

Issued Patents 2002

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6478906 Method for bonding a flexible substrate to a chip Ghassem Azdasht, Herbert Reichl 2002-11-12
6407457 Contact-bumpless chip contacting method and an electronic circuit produced by said method Rolf Aschenbrenner, Hans-Hermann Oppermann, Ghassem Azdasht 2002-06-18