Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6417461 | Circuit substrate | Seiichi Hirahara, Akira IMOTO, Shuji Nakazawa, Tatsuji Furuse | 2002-07-09 |
| 6356173 | High-frequency module coupled via aperture in a ground plane | Koichi Nagata, Kenji Kitazawa, Shinichi Koriyama, Shigeki Morioka, Takanori Kubo +3 more | 2002-03-12 |
| 6337146 | Hydrogen-occluding layered material | Kouichi Sogabe, Shousaku Yamanaka, Yoshinobu Takeda, Nozomu Kawabe, Hideo Itozaki +1 more | 2002-01-08 |