HC

Hidekazu Chiba

OC Oki Electric Industry Co.: 1 patents #92 of 373Top 25%
📍 Rifu, JP: #75 of 223 inventorsTop 35%
Overall (2002): #207,340 of 266,432Top 80%
1
Patents 2002

Issued Patents 2002

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6357650 Method of wire-bonding between pad on semiconductor chip and pad on circuit board on which the semiconductor chip is mounted 2002-03-19