Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6485833 | Resin-coated metal foil | Yasuo Imashiro, Hideshi Tomita, Norimasa Nakamura | 2002-11-26 |
| 6440258 | Adhesive film for semiconductor package | Yasuo Imashiro, Hideshi Tomita, Norimasa Nakamura | 2002-08-27 |
| 6387505 | Prepreg, multilayer printed wiring board and process for production of said multilayer printed wiring board | Yasuo Imashiro, Hideshi Tomita, Norimasa Nakamura | 2002-05-14 |