TH

Tomoaki Hirokawa

NE Nec: 1 patents #469 of 1,934Top 25%
Overall (2002): #100,701 of 266,432Top 40%
1
Patents 2002

Issued Patents 2002

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6340792 Mold cap for semiconductor device mold package — 2002-01-22