Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6486559 | COPPER WIRING STRUCTURE COMPRISING A COPPER MATERIAL BURIED IN A HOLLOW OF AN INSULATING FILM AND A CARBON LAYER BETWEEN THE HOLLOW AND THE COPPER MATERIAL IN SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | — | 2002-11-26 |
| 6482741 | COPPER WIRING STRUCTURE COMPRISING A COPPER MATERIAL BURIED IN A HOLLOW OF AN INSULATING FILM AND A CARBON LAYER BETWEEN THE HOLLOW AND THE COPPER MATERIAL IN SEMICONDUCTOR DEVICE AND METHOD FABRICATING THE SAME | — | 2002-11-19 |
| 6478935 | Semiconductor device plating apparatus | — | 2002-11-12 |
| 6472318 | Method of fabricating semiconductor device having trench interconnection | — | 2002-10-29 |
| 6391168 | Plating apparatus utilizing an auxiliary electrode | — | 2002-05-21 |
| 6377900 | Measuring system for transfer function matrix of a system to be controlled in multi-degree of freedom vibration control | Yoshikado Yamauchi | 2002-04-23 |