Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6491857 | Process of packaging semiconductor chip in synthetic resin produced from pressurized granular synthetic resin and molding die used therein | — | 2002-12-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6491857 | Process of packaging semiconductor chip in synthetic resin produced from pressurized granular synthetic resin and molding die used therein | — | 2002-12-10 |