Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6350838 | Package encapsulant compositions for use in electronic devices | Bodan Ma | 2002-02-26 |
| 6344157 | Conductive and resistive materials with electrical stability for use in electronics devices | Chih-Min Cheng, Gerald Fredrickson, Yue Xiao, Daoqiang Lu | 2002-02-05 |