Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6468832 | Method to encapsulate bumped integrated circuit to create chip scale package | — | 2002-10-22 |
| 6420212 | Method and apparatus to enclose dice | — | 2002-07-16 |
| 6352878 | Method for molding a bumped wafer | Joseph O. Smith | 2002-03-05 |