Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6468892 | Front side coating for bump devices | Mark H. Baker | 2002-10-22 |
| 6462426 | Barrier pad for wafer level chip scale packages | Stephen Gee | 2002-10-08 |
| 6459143 | Method of packaging fuses | Inderjit Singh, Hem Takiar, Ranjan J. Mathew | 2002-10-01 |
| 6448632 | Metal coated markings on integrated circuit devices | Hem Takiar, Ken Pham | 2002-09-10 |
| 6398034 | Universal tape for integrated circuits | Hem Takiar | 2002-06-04 |