Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6479170 | Electrodeposited copper foil, method of inspecting physical properties thereof, and copper-clad laminate employing the electrodeposited copper foil | Naotomi Takahashi | 2002-11-12 |
| 6444112 | Manufacturing method of electrodeposited copper foil | Nobuyuki Imada, Yasuji Hara, Naoya Matsushita | 2002-09-03 |