Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6476507 | Resin sealing method and resin sealing apparatus | — | 2002-11-05 |
| 6402497 | Mold clamping device with improved clamping force transmission mechanism | Toshinobu Banjyo, Shinichi Hasegawa, Haruo Yoshida | 2002-06-11 |
| 6358776 | Method of fabricating an electronic component and apparatus used therefor | Osamu Nakagawa | 2002-03-19 |