Issued Patents 2002
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6403449 | Method of relieving surface tension on a semiconductor wafer | — | 2002-06-11 |
| 6399464 | Packaging die preparation | Tom A. Muntifering, Steven W. Heppler | 2002-06-04 |
| 6394119 | Method for conserving a resource by flow interruption | — | 2002-05-28 |
| 6371840 | Method and apparatus for processing a planar structure | Steve W. Heppler | 2002-04-16 |
| 6363968 | System for conserving a resource by flow interruption | — | 2002-04-02 |
| 6354917 | Method of processing a wafer utilizing a processing slurry | — | 2002-03-12 |
| 6351022 | Method and apparatus for processing a planar structure | Steve W. Heppler | 2002-02-26 |