Issued Patents 2002
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6494357 | Lead penetrating clamping system | — | 2002-12-17 |
| 6484922 | Apparatus and method of clamping semiconductor devices using sliding finger supports | — | 2002-11-26 |
| 6478211 | Device and method for clamping and wire-bonding the leads of a lead frame one set at a time | Rich Fogal | 2002-11-12 |
| 6467672 | Methods for clamping and wire-bonding the leads of a lead frame one set at a time | Rich Fogal | 2002-10-22 |
| 6464123 | Bondhead lead clamp apparatus and method | Rich Fogal | 2002-10-15 |
| 6443822 | Wafer processing apparatus | — | 2002-09-03 |
| 6435400 | Bondhead lead clamp apparatus and method | Rich Fogal | 2002-08-20 |
| 6426564 | Recessed tape and method for forming a BGA assembly | — | 2002-07-30 |
| 6419145 | Lead penetrating clamping system | — | 2002-07-16 |
| 6420256 | Method of improving interconnect of semiconductor devices by using a flattened ball bond | — | 2002-07-16 |
| 6407456 | Multi-chip device utilizing a flip chip and wire bond assembly | — | 2002-06-18 |
| 6390350 | Quick change precisor | Rich Fogal, Ronald W. Ellis | 2002-05-21 |
| 6380635 | Apparatus and methods for coupling conductive leads of semiconductor assemblies | Troy A. Manning | 2002-04-30 |
| 6337227 | Method of fabrication of stacked semiconductor devices | — | 2002-01-08 |
| 6334566 | Device and method for clamping and wire-bonding the leads of a lead frame one set at a time | Rich Fogal | 2002-01-01 |