Issued Patents 2002
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6495912 | Structure of ceramic package with integrated passive devices | Ching-Cheng Huang, Jin-Yuan Lee | 2002-12-17 |
| 6495442 | Post passivation interconnection schemes on top of the IC chips | Jin-Yuan Lee | 2002-12-17 |
| 6489656 | Resistor for high performance system-on-chip using post passivation process | — | 2002-12-03 |
| 6489647 | Capacitor for high performance system-on-chip using post passivation process structure | — | 2002-12-03 |
| 6486563 | Wafer scale packaging scheme | — | 2002-11-26 |
| 6455885 | Inductor structure for high performance system-on-chip using post passivation process | — | 2002-09-24 |
| 6426556 | Reliable metal bumps on top of I/O pads with test probe marks | — | 2002-07-30 |
| 6399997 | High performance system-on-chip using post passivation process and glass substrates | Jin-Yuan Lee | 2002-06-04 |
| 6399975 | Wide bit memory using post passivation interconnection scheme | Vang Cheong, Jin-Yuen Lee | 2002-06-04 |
| 6383916 | Top layers of metal for high performance IC's | — | 2002-05-07 |
| 6356958 | Integrated circuit module has common function known good integrated circuit die with multiple selectable functions | — | 2002-03-12 |
| 6350705 | Wafer scale packaging scheme | — | 2002-02-26 |
| 6351035 | Strain release contact system for integrated circuits | — | 2002-02-26 |