Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6428300 | Ultra mold for encapsulating very thin packages | John J. Lajza, Jr., Robert M. Smith | 2002-08-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6428300 | Ultra mold for encapsulating very thin packages | John J. Lajza, Jr., Robert M. Smith | 2002-08-06 |