Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6489571 | Molded tape ball grid array package | Chok J. Chia, Patrick Variot | 2002-12-03 |
| 6486002 | Tape design to reduce warpage | Ramaswamy Ranganathan, Sengsooi Lim | 2002-11-26 |
| 6429534 | Interposer tape for semiconductor package | Chok J. Chia, Maniam Alagaratnam | 2002-08-06 |
| 6425179 | Method for assembling tape ball grid arrays | Chok J. Chia, Ramaswamy Ranganathan | 2002-07-30 |