Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6457632 | Solder alloy and bonding method of substrate and electric or electronic parts with solder alloy | Kouichi Teshima, Shinji Arai | 2002-10-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6457632 | Solder alloy and bonding method of substrate and electric or electronic parts with solder alloy | Kouichi Teshima, Shinji Arai | 2002-10-01 |