Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6469373 | Semiconductor apparatus with improved thermal and mechanical characteristic under-fill layer and manufacturing method therefor | Hiroshi Funakura | 2002-10-22 |
| 6376907 | Ball grid array type package for semiconductor device | Eiji Takano, Chiaki Takubo | 2002-04-23 |