Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6353189 | Wiring board, wiring board fabrication method, and semiconductor package | Osamu Shimada, Yoshitaka Fukuoka, Kenji Sasaoka | 2002-03-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6353189 | Wiring board, wiring board fabrication method, and semiconductor package | Osamu Shimada, Yoshitaka Fukuoka, Kenji Sasaoka | 2002-03-05 |