Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6476481 | High current capacity semiconductor device package and lead frame with large area connection posts and modified outline | Arthur Woodworth, Ken Teasdale | 2002-11-05 |
| 6465875 | Semiconductor device package with plural pad lead frame | Glyn Connah | 2002-10-15 |
| 6396091 | Chip scale package | — | 2002-05-28 |
| 6348727 | High current semiconductor device package with plastic housing and conductive tab | Paul Westmarland, Alberto Guerra | 2002-02-19 |