Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6429389 | Via-in-pad apparatus and methods | Ji Yoon Chung | 2002-08-06 |
| 6395995 | Apparatus for coupling integrated circuit packages to bonding pads having vias | Dan Shier | 2002-05-28 |