Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6490166 | Integrated circuit package having a substrate vent hole | Suresh Ramalingam, Nagesh Vodrahalli, Michael J. Costello, Mun Leong Loke | 2002-12-03 |
| 6365441 | Partial underfill for flip-chip electronic packages | George F. Raiser, Bob Sundahl | 2002-04-02 |