Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6357330 | Method and apparatus for cutting a wafer | Isaura S. Gaeta, Krishna Seshan | 2002-03-19 |
| 6352940 | Semiconductor passivation deposition process for interfacial adhesion | Krishna Seshan, Geoffrey Bakker | 2002-03-05 |