Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6501166 | Stitched plane structure and process for package power delivery and dual referenced stripline I/O performance | Dustin P. Wood, Seng Hooi Ong | 2002-12-31 |
| 6429051 | Stitched plane structure for package power delivery and dual referenced stripline I/O performance | Dustin P. Wood, Seng Hooi Ong | 2002-08-06 |
| 6400028 | Alignment of vias in circuit boards or similar structures | — | 2002-06-04 |
| 6393374 | Programmable thermal management of an integrated circuit die | Linda J. Rankin, Stephen H. Gunther, Jack D. Pippin | 2002-05-21 |