Issued Patents 2002
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6495770 | Electronic assembly providing shunting of electrical current | Yuan-Liang Li, Priyavadan R. Patel | 2002-12-17 |
| 6493861 | Interconnected series of plated through hole vias and method of fabrication therefor | Yuan-Liang Li | 2002-12-10 |
| 6483692 | Capacitor with extended surface lands and method of fabrication therefor | Huong Do, Jorge P. Rodriguez, Michael Walk | 2002-11-19 |
| 6476477 | Electronic assembly providing shunting of electrical current | Yuan-Liang Li, Priyavadan R. Patel | 2002-11-05 |
| 6469908 | Dual-socket interposer and method of fabrication therefor | P. R. Patel, Yuan-Liang Li, Shamala Chickamenahalli, Huong Do | 2002-10-22 |
| 6446317 | Hybrid capacitor and method of fabrication therefor | Yuan-Liang Li, Huong Do | 2002-09-10 |
| 6428358 | Socket with embedded conductive structure and method of fabrication therefor | Chee-Yee Chung, Kristopher Frutschy, Farzaneh Yahyaei-Moayyed | 2002-08-06 |
| 6407929 | Electronic package having embedded capacitors and method of fabrication therefor | Aaron Dean Hale, Michael Walk, Joan K. Vrtis, Toshimi Kohmura | 2002-06-18 |
| 6388207 | Electronic assembly with trench structures and methods of manufacture | Michael Walk, Yuan-Liang Li, Robert L. Sankman | 2002-05-14 |
| 6366467 | Dual-socket interposer and method of fabrication therefor | P. R. Patel, Yuan-Liang Li, Shamala Chickamenahalli, Huong Do | 2002-04-02 |
| 6346743 | Embedded capacitor assembly in a package | Yuan-Liang Li, Chee-Yee Chung | 2002-02-12 |