Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6413849 | Integrated circuit package with surface mounted pins on an organic substrate and method of fabrication therefor | Hwai-Peng Yeoh, Hamid Azimi, Mirng-Ji Lii | 2002-07-02 |