TJ

Thies Janczek

Infineon Technologies Ag: 3 patents #61 of 647Top 10%
📍 Molfsee, DE: #1 of 3 inventorsTop 35%
Overall (2002): #19,768 of 266,432Top 8%
3
Patents 2002

Issued Patents 2002

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
6469086 Plastic molding compound, composite body, and filler for a plastic molding compound Achim Neu, Alexandra Atzesdorfer 2002-10-22
6400006 Integrated component, composite element comprising an integrated component and a conductor structure, chip card, and method of producing the integrated component Achim Neu 2002-06-04
6364205 Chip card having a contact zone and method of producing such a chip card Peter Stampka 2002-04-02