Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6351032 | Method and structure for heatspreader attachment in high thermal performance IC packages | Bernard K H Lee, Ben T C Tan, Emillo F. Mallare, Jr., Sarvotham Bhandarkar, Subodh Mhaisalkar | 2002-02-26 |