Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6489573 | Electrode bonding structure for reducing the thermal expansion of the flexible printed circuit board during the bonding process | Jiun-Han Wu, Po-Cheng Chen | 2002-12-03 |
| 6376813 | Plasma display panel with a heating means for temperature balance and the method of the same | Chien-Hsing Li, Huang Yu-Ming | 2002-04-23 |