YM

Yohji Maeda

IBM: 1 patents #1,916 of 5,400Top 40%
📍 Moriyama, JP: #72 of 271 inventorsTop 30%
Overall (2002): #85,947 of 266,432Top 35%
1
Patents 2002

Issued Patents 2002

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6427898 Solder bump forming method and apparatus Yutaka Tsukada 2002-08-06