Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6426557 | Self-aligned last-metal C4 interconnection layer for Cu technologies | Timothy H. Daubenspeck, William T. Motsiff | 2002-07-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6426557 | Self-aligned last-metal C4 interconnection layer for Cu technologies | Timothy H. Daubenspeck, William T. Motsiff | 2002-07-30 |