Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6358439 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron, Hal Mitchell Lasky +6 more | 2002-03-19 |