Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6451155 | Method using a thin adhesion promoting layer for bonding silicone elastomeric material to nickel and use thereof in making a heat sink assembly | Hilton T. Toy, Da-Yuan Shih, Ajay P. Giri | 2002-09-17 |
| 6444082 | Apparatus and method for removing a bonded lid from a substrate | Barrie C. Campbell, Ronald L. Hering, Richard F. Shortt | 2002-09-03 |
| 6444496 | Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof | Glenn G. Daves, Shaji Farooq, Sushumna Iruvanti, Frank L. Pompeo | 2002-09-03 |
| 6436223 | Process and apparatus for improved module assembly using shape memory alloy springs | Enrique C. Abreu, Ronald L. Hering, David C. Olson | 2002-08-20 |
| 6373133 | Multi-chip module and heat-sink cap combination | Giulio DiGiacomo, Stephen S. Drofitz, Jr., Larry D. Gross, Sushumna Iruvanti, Raed A. Sherif +4 more | 2002-04-16 |
| 6365977 | Insulating interposer between two electronic components and process thereof | Norman J. Dauerer, Glenn G. Daves | 2002-04-02 |