Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6484394 | Encapsulation method for ball grid array semiconductor package | Seong-Jae Heo | 2002-11-26 |
| 6441498 | Semiconductor substrate and land grid array semiconductor package using same | — | 2002-08-27 |