Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6500566 | Very ultra thin conductor-layers for printed wiring boards | — | 2002-12-31 |
| 6368697 | Method of manufacturing an interlayer via and a laminate precursor useful for same | Michael A. Petti | 2002-04-09 |