Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6486411 | Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrate | Kazuma Miura, Hanae Shimokawa, Koji Serizawa, Tasao Soga | 2002-11-26 |