Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6365432 | Fabrication process of semiconductor package and semiconductor package | Naoki Fukutomi, Yoshiaki Tsubomatsu, Toshio Yamazaki, Hirohito Ohhata, Shinsuke Hagiwara +2 more | 2002-04-02 |