CL

Che-Yu Li

HD High Connection Density: 6 patents #1 of 8Top 15%
📍 Ithaca, NY: #4 of 120 inventorsTop 4%
🗺 New York: #256 of 9,277 inventorsTop 3%
Overall (2002): #6,631 of 266,432Top 3%
6
Patents 2002

Issued Patents 2002

Showing 1–6 of 6 patents

Patent #TitleCo-InventorsDate
6496380 High capacity memory module with high electrical design margins David A. Lysack, Thomas L. Sly 2002-12-17
6480014 High density, high frequency memory chip modules having thermal management structures Thomas L. Sly, Weimin Shi 2002-11-12
6471525 Shielded carrier for land grid array connectors and a process for fabricating same Zhineng Fan, Ai D. Le 2002-10-29
6439894 Contact assembly for land grid array interposer or electrical connector 2002-08-27
6381164 Low profile, high density memory system Zhineng Fan, Ai D. Le 2002-04-30
6370770 Carrier for land grid array connectors Zhineng Fan, Ai D. Le 2002-04-16