Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6468813 | Method of automatically identifying and skipping defective work pieces for wire-bonding operation | Te-Tsung Chao | 2002-10-22 |
| 6457235 | Method of wire-bonding circuit chip to bonding pad | Te-Tsung Chuo | 2002-10-01 |
| 6405357 | Method for positioning bond pads in a semiconductor die | Te-Tsung Chao | 2002-06-11 |
| 6391759 | Bonding method which prevents wire sweep and the wire structure thereof | Te-Tsung Chao | 2002-05-21 |