Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6461953 | Solder bump forming method, electronic component mounting method, and electronic component mounting structure | Hiroki Uchida | 2002-10-08 |
| 6345757 | Reflow soldering method | Taro Matsuoka | 2002-02-12 |