Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6469394 | Conductive interconnect structures and methods for forming conductive interconnect structures | Connie M. Wong | 2002-10-22 |
| 6444921 | Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like | Wen-chou Vincent Wang, Solomon I. Beilin | 2002-09-03 |
| 6428942 | Multilayer circuit structure build up method | Hunt Hang Jiang, Yasuhito Takahashi, Wen-chou Vincent Wang, Mark Thomas McCormack | 2002-08-06 |
| 6343171 | Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making | Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, William T. Chou, Solomon I. Beilin +3 more | 2002-01-29 |