Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6485814 | High density thin film circuit board and method of production thereof | Mikio Nishihara | 2002-11-26 |
| 6465085 | Thin film wiring board and method for manufacturing the same, base substrate and method for manufacturing the same | Zhiyi Song, Takami Sasahara, Norikazu Ozaki, Manabu Watanabe, Misao Umematsu +1 more | 2002-10-15 |
| 6410983 | Semiconductor device having a plurality of multi-chip modules interconnected by a wiring board having an interface LSI chip | Satoshi Osawa | 2002-06-25 |
| 6399897 | Multi-layer wiring substrate | Misao Umematsu, Shunichi Kikuchi, Kazuaki Satoh, Norikazu Ozaki | 2002-06-04 |