PE

Peter Elenius

FL Flip Chip Technologies, L.L.C.: 1 patents #1 of 4Top 25%
📍 Hopewell Junction, NY: #45 of 100 inventorsTop 45%
🗺 New York: #3,002 of 9,277 inventorsTop 35%
Overall (2002): #140,223 of 266,432Top 55%
1
Patents 2002

Issued Patents 2002

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6441487 Chip scale package using large ductile solder balls Harry Hollack 2002-08-27