Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6492196 | Packaging process for wafer level IC device | — | 2002-12-10 |
| 6448110 | Method for fabricating a dual-chip package and package formed | Chun-Liang Chen | 2002-09-10 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6492196 | Packaging process for wafer level IC device | — | 2002-12-10 |
| 6448110 | Method for fabricating a dual-chip package and package formed | Chun-Liang Chen | 2002-09-10 |